End Markets
Package Testing System for Healthcare & Food Packaging Markets
Ametek Mocon’s Dansensor Lippke 5000 tests for package integrity on the production floor or in the lab.
Read MorePrent to Open New Rigid Thermoform Medical Packaging Plant in New Mexico
Prent aims to start up new rigid thermoform facility by Fall 2021 in southern New Mexico.
Read MoreCadillac Products Debuts New Brand Line of Medical Gowns
As PPE demand rises, automotive supplier and packaging manufacturer Cadillac Products steps-up with new line of extruded medical gowns.
Read MoreMatte BOPP Compound for Cold Seal Packaging of Heat-Sensitive Products
Ampacet’s new Matif CSR 330 BOPP matte compound designed for cold seal packaging of chocolate, snack bars and ice cream.
Read MoreNew Compounds Prevent Cracking of Medical Devices
Avient’s new Trilliant HC BPA-free compounds boast improved chemical resistance over other flame-retardant thermoplastic healthcare formulations.
Read MoreLights Out, Pristine Production In
The numbers beggar belief and the 大象传媒 belies description—Medical Components of America has six full-time employees, six injection machines and lights-out production that’s gone five years without shipping a bad part or missing a delivery.
Read MoreSteinbeck Named CEO of W&H
Succeeds long-time CEO Jürgen Vutz, who will join the company’s Supervisory Board beginning the new year.
Read MoreNvision Gets FDA Clearance for First Osteotomy Wedge Implant Made of Specialty PEEK Compound
Ivibio’s PEEK-Optima HA Enhanced bone on-growth biomaterial used in Nvision’s Trigon osteotomy wedge fixation system.
Read MoreBerry’s Bold Sustainability Benchmarks
Worldwide packaging behemoth Berry Global has staked out a market-leading sustainability position with ambitious near- and long-term goals. Executive VP and General Manager Brian Hunt discussed the company’s efforts with Plastics Technology, including a new line of PCR containing caps and closures.
Read MoreFilm Processor Boosts Line Performance with Air-Ring Retrofit
Air-ring upgrade results in output gains up to 23% for leading film processor in Indonesia. Gauge uniformity also improved.
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