Compact Stack Mold for Thin-Wall Packaging
Oerlikon HRSflow says the patent-pending design allows the use of smaller injection molding machines while still promising the high output a stack mold tool.
Hot runner manufacturer Oerlikon HRSflow has designed a patent-pending compact stack mold for thin wall packaging applications. Designed to withstand high filling pressures for thin wall packaging applications, the system, which will be available soon, can be run on lower tonnage injection molding machines and is equipped with the company’s Xd nozzle series.
The design fits a maximum hot half plate thickness of 220 mm with a minimum distance between the gates on either side of the plate of 260 mm. In a video released with the announcement, Oerlikon HRSflow showed a four-drop design molding two 210-ml single-serving cups in recycled PP with a weight of 6.3g and a wall thickness of 0.3 mm on either side of the middle plate. What Oerlikon HRSflow calls a “mosaic” design on the cups’ walls was patented by moldmaker Collomb and imparts robustness to the container despite the thin walls.
The center plate of Oerlikon HRSflow’s stack mold fits a maximum hot-half plate thickness of 220 mm.
Photo Credit: Oerlikon HRSflow
Related Content
-
PHA Compound Molded into “World’s First” Biodegradable Bottle Closures
Beyond Plastic and partners have created a certified biodegradable PHA compound that can be injection molded into 38-mm closures in a sub 6-second cycle from a multicavity hot runner tool.
-
Automotive Awards Highlight ‘Firsts,’ Emerging Technologies
Annual SPE event recognizes sustainability as a major theme.
-
Latest Data on Bottled Water Shows Continued Strong Growth
Bottled water’s volume surpassed soft drinks for the first time in 2016 and has done so every year since.
